JIS Z 3197 PDF

Brass and copper Brass and copper for consumer product. The residua can be completely removed with luke-warm simple water rinse. Halogen-free soldering agent for tin bismuth system unleaded tin paste and preparation method thereof. Halogen-free low-splash solder wire and preparation method of halogen-free low-splash solder wire.

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Brass and copper Brass and copper for consumer product. The residua can be completely removed with luke-warm simple water rinse. Halogen-free soldering agent for tin bismuth system unleaded tin paste and preparation method thereof.

Halogen-free low-splash solder wire and preparation method of halogen-free low-splash solder wire. Brass and copper for consumer product. Solder fillets can left up to 24 hours and still remains shiny prior sending for post washing with water. Low-splash and halogen-free welding agent for tin wires and preparation jie thereof. Low-rosin cleaning-free scaling powder for SnAgCu series lead-free soldering paste and preparation method thereof. Colophony type non-halide cleaning-free soldering flux for lead-free solder wire.

This flux is a high activity, heat stable with minimal fumes and odor. More than 90 SnPb More than 80 Sn Halogen-free lead-free soldering paste for radiator and preparation method thereof. Flux for soldering electronic components on circuit substrates, and mounted or unmounted circuit substrate. Water — soluble core flux. A soldering flux as claimed in claim 5, characterized in jjs More than 90 SnPb. The said organic acid could be one or more of the aliphatic acid mono acid or bi-acid, aromatic acid, or amino acid.

CN CNA en The soldering flux does not have halogen, being environmental protective, good in welding, welding spot being full and luminous, without residue, no corrosion, high in isolation resistance. The film-forming substance in the raw material, i. Preparation and use of the same method as in Example 1.

The invention relates to a lead free soldering clean free soldering flux with the mass percentage of organic acid activating 1. The said surface active agent is one or more of the nonion surface active agent, and the said organic amine and the derivant being ethanediamine, tetramethylenediamine, diethyl ethanolamine and so on, with the said film forming material being diethyl ethanolamine or resin. Aqueous cleaning soldering flux for lead-free soldering and preparation method thereof.

The residues left are near neutral pH and the core-flux can be utilized with an open torch flame or a soldering iron.

Fast and excellent instant wetting action used mainly by consumer products assemblies manufacturer. A lead-free solder was washed with halogen-free flux, components of the by mass percentage: Related Posts

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Neramar The soldering flux does not have halogen, being environmental protective, good in welding, welding spot being full and luminous, without residue, no corrosion, high in isolation resistance. Water — soluble core flux. Aqueous cleaning soldering flux for lead-free soldering and preparation method thereof. A lead-free solder was washed with halogen-free flux, components of the flux by mass percentage: Clear residue core flux for lead-free alloy cored solder wire was developed for minimal spitting, fast and excellent instant wetting action, ideally suitable for critical products assemblies manufacturer requiring.

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JIS Z 3197 PDF

Aqueous cleaning soldering flux for lead-free soldering and preparation method thereof. CNA — Non-halide cleaning-free welding flux for leadless solder — Google Patents The residua can be completely removed with luke-warm simple water rinse. A flux according to claim 1, wherein: The said surface active agent is one or more of the nonion surface active agent, and the said organic amine and the derivant being ethanediamine, tetramethylenediamine, diethyl ethanolamine and so on, with the said film forming material being diethyl ethanolamine or resin. Brass and copper for consumer product. Fast and excellent instant wetting action used mainly by consumer products assemblies manufacturer.

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